Temel bilgiler.
Hayır. Modeli.
KSM-S6189R01
Tip
Solvent bazlı Mürekkep
Yazdırma Türü
Ekran Yazdırma
Exposure Energy
400~600mj/Cm2
Ürün Açıklaması
KSM-S6189R01 is photoimageable solder mask. It has good screen printing
adaptability , excellent adhesion , high resistance to chemicals and heat. It has
extensive operating conditions . This liquid photoimageable solder mask possesses
easy operation and is wildly accepted.Properties of ink :Items | Features | Notes |
Color | Red | |
Fineness | ≤8µm | 0 ~25µm Fineness gauge |
Mix ratio | Base/Hardener=3:1 | Weight ratio |
Solid content after mixing | 75±3% | |
Viscosity after mixing (25ºC) | 200±30 dPa.s | VT-04F |
Density after mixing (25ºC) | 1.20 ~1.30 g/ml | |
Pot life after mixing | 24 hour | Store below 25ºC in dark |
Pre-baking limit | 75ºC , 60 min | |
Exposure energy | 400 ~600 mJ/cm2 | The effective value through the polyester film |
Package | Base :750g , Hardener :250 g | Conventional Packaging |
Shelf life | 6 months since the date of manufacture | Store below 25ºC in dark |
Properties of the film (after post cured)Items | Features | Notes |
Pencil hardness | ≥6H | Pencil harder,JIS K5400 8.4 |
Adhesion | 100/100 | Laceration experiment,JIS K5400 8.5 |
Solvent resistance | Good | 25ºC,C2H5OH ,20min |
Acid resistance | Good | 25ºC,10vol%H2SO4 ,20min |
Alkali resistance | Good | 25ºC,10wt%NaOH ,20min |
Boiling water resistance | Good | 100ºC, 30min |
Insulation resistance | ≥1.0×1012Ω | IPC-SM-840C 3.8.2 |
CTI | ≥600 | IEC 60112:2003 |
Resistance to molten solder | 288ºC×10 seconds×3 times OK | JIS C6481 5.5 |
Resistance to flame | UL94V-0 | Certified number:UL-E189612 |
Chemical-plating nickel/aurum | OK | Ni:5μm; Au:0.05μm |
Attention :
1. The base and hardener should be mixed according to the ratio and stirred thoroughly before using.2. We will offer you special diluent if the ink need dilute.
3. The values above are based on experiments in our lab. Experiments need to be
carried out in order to get proper using condition. Liquid photoimageable solder mask directions of use
1.Working procedureProcedure | Content |
(1) Mixing | Mixing about 30g main agent with hardener and stirring thoroughly,then mixing the mixture above with the remanent main agent and stirring 5 ~10 minutes. The viscosity of ink is adjusted to 120±20 ps if printed by hand. And it is adjusted to 160 ± 20 ps if printed by machine. The viscosity of ink mixed above is measured at 25 ºC .Please use the special diluent of our company if the viscosity of ink needs to adjust. |
(2) Remain time | 10 ~15 minutes after stirring uniformly |
(3) Screen mesh | Ordinary boards:43T ; Chemical-plating Aurum or Tin boards:36T |
(4) Pre-baking | 1. Single side printing separately First side :72 ~76ºC ,20 ~25min Second side : 72 ~76ºC , 30 ~35min 2. Double sides printing simultaneously : 72 ~76ºC , 40 ~60min |
(5) Exposure | 400~600mJ/cm2(the effective value through the polyester film), 10~12 step |
(6) Developing | Developing solution :0.8 ~1.2wt%Na2CO3 or K2CO3 aqueous solution Developing solution temperature :28 ~32ºC Spray pressure:2.5~3.0kg/cm2 Developing time:60~90 seconds |
(7) Post cure | Spray Tin board:150ºC×60~120 min;Chemical-plating Aurum or Tin board:150ºC×50~60 min; boards filled with ink in the hole should be post-baked in subsection:75ºC×60~120 min+100ºC×30 min+150ºC×60 min |
2. Caution 1. Requirements of working place :the temperature should be 20~23ºC and humidity is 45~65% in the room for printing and exposure without dust. Please work in the place without UV ray , or it will cause photo polymerization if the ink is used in the irradiation of white ray or sunlight. |
2. Mixing the main agent with hardener and stirring thoroughly and using only in room temperature. |
3. Appropriate film thickness is from 18 to 22μm. Thinner film will reduce the resistance to heat , chemicals and plating. Thicker film will cause excess under-cut and reduce the degree of dryness because the irradiation can not cure the botton layer of the ink. |
4. The screen boards can not be pasted with adhesion tape directly or else the remanent mucus will cause hollow pot on board. |
5.The ink can not be printed into the accessory hole. Developing time should be increased if ink gets into the accessory hole or there will be uncleaned. |
6. The condition and allowed range of pre-baking vary with the oven type and different number of boards in the oven. Experiments need to be carried out to get proper condition. |
7. Exposure energy varies with the board material and ink thinkness. Experiments should be carried out to determine the minimum width , surface gloss and the sensitization of the botton surface and then set proper condition. |
8.Inadequate developing temperature and time may cause unclean developing and over of them can cause excess under-cut and the feature of ink will be influenced because of the attack of ink surface. Please control the concentration of developing solution , temperature , pressure and developing time strictly. Experiments need to be carried out to get proper condition. |
9. The ink is easy to remove when the temperature and time of post-baking is deficient. It will reduce the resistance to plating aurum and molten solder when the post-baking time is over 2.5 hours. Experiments need to be carried out to set proper conditions of spraying tin and plating aurum. |
10. Experiment whether the ink can afford attack of the process of wave crest solder when the flux is rosin. |
11. Taphole boards are baked in subsection : 75ºC×60~120 min+100ºC×30 min+150×60 min. |
12. Please set proper post-baking tine of solder resist to suit for printing marking ink.Deficient or over hardening can reduce the feature of ink. |
13. Condition of chemical-plating aurum : A. use 36T screen for printing. B. The sensitization of exposure energy is 10 to 12 step. C. Under-cut is controlled below 1 mil after developing or the film will easily be attacked by the liquid medicine in the process of chemical-plating aurum. D. The film need to cure through the UV bump again if the exposure is not enough . E. Chemical-plate aurum or tin first and then print marking ink. or excess hardening will reduce the resistance to chemical properties. |
Adres:
No. 18, Huacheng Road, Industrial Concentration Zone, Qingyang Town, Jiangyin City, Wuxi, Jiangsu, China
İşletme Türü:
Üretici/Fabrika
İşletme Aralığı:
Ambalaj ve Baskı, Araçlar ve Sayaçlar, Bilgisayar Ürünleri, Elektrik ve Elektronik, Hafif Sanayi ve Günlük Kullanım, Işıklar ve Aydınlatma, Kimyasallar, Çantalar, Kılıflar ve Kutular, Üretim ve İşleme Makineleri
Şirket Tanıtımı:
JIANGSU KUANGSHUN FOTOHASSASIYETLI YENI MALZEME STOKU Co., Ltd...Committed, yüksek teknoloji ürünü ve yüksek kaliteli yeni fotohassasiyetli malzemelerin geliştirilmesi ve üretilmesi, özellikle Ar-Ge, PCB mürekkep üretimi ve satışıyla ilgilanıyor. Şirketin bağımsız AR-GE kabiliyeti yüksek performansı vardır, lider yerel PCB mürekkep üreticisidir... PCB mürekkep üretimi RoHS çevresel direktiflerinin gerekliliklerine uygun olarak dünya seviyesine ulaşmıştır, Mükemmel kalite ve yüksek kaliteli hizmet, Apple iPhone5 cep telefonu üreticileri Foxconn′un tanınması da dahil olmak üzere çok sayıda kullanıcının güvenini kazanmıştır.
JIANGSU KUANGSHUN ISO9001 sertifikası ve ISO 14000 çevre yönetim sistemi sertifikası ile yeterlilik standartları, ulusal bir yüksek teknoloji kuruluşudur. Şirketin en önemli ürün lehim maskesi mürekkebi KSM-S6188 serisi, KSM-S6189 serisi, KSM-180 serisi ürünleri Amerikan güvenlik sertifikasyonu tarafından onaylanmıştır.
Şirketimiz farklı ürün türleri konusunda uzmandır. Yönetim için "önce kalite, önce servis, müşterileri karşılamak için sürekli gelişim ve yenilik" ve kalite açısından "sıfır kusur, sıfır şikayet" prensibine bağlı kalırız. Hizmetimizi mükemmelleştirmek için ürünlerimizi makul fiyata iyi kalitede üretiyoruz.