CNC Cam Kesme Makinesi Lazer Kesici Lazer Kontrol Cihazı PCB kesme

1.Smooth cutting edge without burrs,dust and kernel.

2.High accuracy exterior cutting,especially suitable for cutting of small arc exterior.

3.Low thermal effect on workpiece without laminate.Low defective reate.

4.One step cutting for complex materials with different thickness.

5.Automatic adjust laser head height.

6.Non-touch machining without thermal deformation.

7.Linear motor driven of platform with high speed and steady feeding.

8.Postioning holes are preserved on platform,which makes it easy to fix PCB and processing.

9.Vacuum absorb platform without any fixtures.

10.One time machining of different shape,decrease delivery period.

11.Imported image positioning technology for high accuracy machining requirement.

12.Imported power measuring system.It can detect laser power at arbitrary time,to ensure high quality.

13.Full sealed optical path,to ensure stable machining and reliability.

1.Flexible circuit board cutting/Auxiliary material cutting(such as strengthen,steel disc),cover film cutting,etc.

2.Laser drilling,such as FPC drilling,LTCC drilling,etc.

3.Patch PCB molding.

4.GBA/Connecting fingers repair/permeability gold eliminate/repair welding plate.

5.SD card cutting

6.Joint(hard and soft) board open.