| SHENZHEN OKEY CIRCUIT CO.,LTD |
| PCB Manufacturing Capabilities: |
| Layers |
1-20 Layers |
| Laminate |
FR4, H-TG, CEM, Aluminum, Copper Base, Rogers, |
| Ceramics, Iron Base |
| Max. Board Size |
1200*480mm |
| Min.Board Thickness |
2-Layer 0.15mm |
| 4-Layer 0.4mm |
| 6-Layer 0.6mm |
| 8-Layer 1.5mm |
| 10-Layer 1.6-2.0mm |
| Min. Line Width/Trace |
0.1mm(4mil) |
| Max. Copper Thickness |
10 OZ |
| Min. S/M Pitch |
0.1mm(4mil) |
| Max. S/M Pitch |
0.2mm(8mil) |
| Min. Hole Dia. |
0.2mm(8mil) |
| Hole Dia. Tolerance(PTH) |
±0.05mm(2mil) |
| Hole Dia. Tolerance(NPTH) |
±0.05mm(2mil) |
| Hole Position Deviation |
±0.05mm(2mil) |
| Outline Tolerance |
±0.1mm(4mil) |
| Twist/Bent |
0.75% |
| Insulation Resistance |
>1012Ω Normal |
| Electric Strength |
>1.3kv/mm |
| S/M Abrasion |
>6H |
| Thermal Stress |
288ºC 10Sec |
| Test Voltage |
50-300V |
| Min. Blind/Buried Via |
0.15mm(6mil) |
| Surface Treatment |
OSP,HASL,LF-HASL,ENIG,Gold/Au Plating,Immersion Ag/Silver, |
| Ag/Silver Plating,Immersion Tin,Tin Plating |
| Testing |
E-test, Fly probe test |
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| PCB Assembly Manufacturing Capabilities: |
| Type of Assembly |
SMT (Surface-Mount Technology) |
| DIP (Dual Inline-pin Package) |
| SMT & DIP mixed |
| Double-sided SMT and DIP assembly |
| Solder Type |
Water Soluble Solder Paste, Leaded process and Lead-Free (RoHS) |
| Components |
Passives parts, smallest size 0201 |
| BGA, uBGA, QFN, SOP, TTSOP, and Leadless chips |
| Fine Pitch to 0.8Mils |
| BGA Repair and Reball, Part Removal and Replacement |
| Connectors and Terminals |
| Bare Board Size |
Smallest:0.25''x 0.25'' (6.35mm x 6.35mm) |
| Largest: 20'' x 20'' (508mm x 508mm) |
| Largest LED PCB: 47'' x 39'' (1200mm x 480mm) |
| Min. IC Pitch |
0.012'' (0.3mm) |
| QFN Lead Pitch |
0.012'' (0.3mm) |
| Max. BGA size |
2.90'' x 2.90'' (74mm x 74mm) |
| Testing |
X-ray Inspection |
| AOI (Automated Optical Inspection) |
| ICT (In-Circuit Test)/Functional Testing |
| Component Packaging |
Reels, cut tape, Tube and tray, Loose parts and bulk |