Elektrik Dağıtım tapaları alüminyum Nitrür (AIN) Seramik

• Uygulama: Refrakter, yapı seramiği, endüstriyel seramik
• Tip: seramik plakalar
• ad: alüminyum nitrür (ain) seramik
• yoğunluk: 3,3 g/cm3
• termal iletkenlik: 180 w/m * k
• saflık: %99.7 alüminyum nitrür
• Hayır. Modeli.: Aluminum Nitride (AIN) ceramic
• teknoloji: sıcak presleme alüminyum nitrür
• anahtar sözcük: hp aln alüminyum nitrür
• esnek mukavemet: 350 mpa
• elastikiyet modülü: 320 gpa
• kablo demeti: 890 hl
• termal genleşme katsayısı: 4.4
• dielektrik sabiti: 9
• kullanım: termal iletkenlik
• maks. boyut: od380 * h50 mm
• dışa aktarma deneyimi: alüminyum nitrür (ain) seramik
• avantaj: yarı iletken alüminyum nitrür seramik parçalar
• malzeme: alüminyum nitrür
• Taşıma Paketi: Air Freight Safety Packing
• Teknik Özelikler: 365*345*50mm
• Ticari Marka: PENSC aln aluminum nitride
• Menşei: Çin
• HS Kodu: 6914900000
• Üretim Kapasitesi: 320000PCS Per Day

Ürün Açıklaması

 

Company Profile

Shandong Pengcheng Advanced Ceramics Co.,Ltd is set up since year of 1997, focus on ALN ALUMINUM NITRIDE Ceramic materials research & production.

 

HP AlN Ceramics, purity 99.5%, thermal conductivity has 140w/(m*k)to 210w/(m*k).
 

Possessed 44 sets of vacuum furnaces and matched processing, testing equipments, ranking first of China in the output,quality and sales volume.
hot pressing ALN aluminum nitride ceramic heater 24304-00-5
aluminum nitride aln hot pressing ceramic plate
aluminum nitride aln ceramic ESC electro static chucks
aluminum nitride aln ceramic Semiconductor Components
hot pressed aluminum nitride aln ceramic heater plate
Aluminum Nitride (AIN) ceramic

Product Description

 

Hot pressing ALN Aluminum nitride ceramic

- High purity
- Electrical insulator
- High thermal conductivity
- Critical thermal management material
- Reduced Particulate Generation
- Corrosion/Erosion Resistance
- Controlled Electrical Properties

Warpage	Density	Melting point	RT Resistivity	Dielectric Constant	Dielectric Loss	Dielectric Breakdown Voltage	Bending strength	Young's Modulus
<2.5‰	3.3g/cm^3	2053ºC	10^14Ω·cm	8.8(1MHz)	5(1MHz)	>15kv/mm	380MPa	340Gpa
Coefficient of heat expansion	Specific Heat at RT	Thermal Expansion	Thermal Conductivity	Shape
4.6(10^-6/k)	740J/(kg.K)	5(10^-6/K)	140-210w/m*k	Customized

 

Typical Application

 

- Cover plates and MRI equipment(Magnetic Resonance Imaging)
- High-power detectors, plasma generators, military radios
- Electrostatic chucks and heating plates for semiconductors and integrated circuits
- Infrared and microwave window material

 

Packaging & Shipping

 

 

Kevin Wang is the guy willing to achieve mutually beneficial cooperation with your