Özelleştirme: | Mevcut |
---|---|
Tip: | Sabit Devre Kartı |
Dielektrik: | FR-4 -> FR-4 |
Hala karar veremediniz mi? $ ! örneklerini alın.
Numune İste
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Doğrulanmış işletme lisanslarına sahip tedarikçiler
Bağımsız bir üçüncü taraf teftiş kuruluşu tarafından denetlenmiştir
Stencil Size:
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736x736mm
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Minimum IC Pitch:
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0.2mm
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Maximum PCB size:
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1200x 500mm
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Minimum PCB thickness:
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0.25mm
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Minimum chip size:
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0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
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Maximum BGA size:
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74x74mm
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BGA ball pitch:
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1.00mm (minimum), 3.00mm (maximum)
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BGA ball diameter:
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0.40mm (minimum), 1.00mm (maximum)
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QFP lead pitch:
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0.38mm (minimum), 2.54mm (maximum)
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Volume:
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One piece to low volume production quantities Low cost first article builds Schedule deliveries |
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Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly |
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Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
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Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
Solder type:
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Leaded Lead-free/ROHS compliant |
Other capabilities:
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Repair/rework services Mechanical assembly Box build Mold and plastic injection. |