Customized Copper/ Aluminum Multi-Layer PCB Manufacturer

• Tip: Sabit Devre Kartı
• Dielektrik: FR-4
• Malzeme: Fiberglas Epoksi
• Uygulama: Tüketici Elektroniği
• Ateşe dayanıklı Özellikler: V0
• Mekanik sert: Sert
• Hayır. Modeli.: OKey-am-0033
• İşlem Teknolojisi: Elektrolitik Folyo
• Taban Malzemesi: Alüminyum
• Yalıtım Malzemeleri: Organik reçine
• satış hizmeti: 24 saat çevrimiçi servis
• sipariş kabul edilebilir: numune siparişi ve küçük sipariş
• mühendis hizmeti: pcb gerber dosyasını kopyala
• ürün özellikleri: çift taraflı kırmızı maske
• sertifikalar: ul, rohs, sgs, iso9001
• Taşıma Paketi: Inner Vacuum Packed Outside in Carton
• Teknik Özelikler: UL, Rohs, ISO9001: 2008
• Ticari Marka: OKEY
• Menşei: Shenzhen City, China
• HS Kodu: 8534009000
• Üretim Kapasitesi: 20 000 Square Meters Per Month

Ürün Açıklaması

Technical Capabilities
Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Max. Board size		2000×610mm
Min. board Thickness		2-layer 0.15mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 1.5mm
		10-layer 1.6~2.0mm
Min. line Width/Space		0.1mm(4mil)
Max. Copper thickness		10OZ
Min. S/M Pitch		0.1mm(4mil)
Min. hole size		0.2mm(8mil)
Hole dia. Tolerance (PTH)		±0.05mm(2mil)
Hole dia. Tolerance		,+0/-0.05mm(2mil)
Hole position deviation		±0.05mm(2mil)
Outline tolerance		±0.10mm(4mil)
Twist & Bent		0.75%
Insulation Resistance		>10 12 Ω Normal
Electric strength		>1.3kv/mm
S/M abrasion		>6H
Thermal stress		288°C 10Sec
Test Voltage		50-300V
Min. blind/buried via		0.15mm (6mil)
Surface Finished		HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
Materials		FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm

Printed circuit board with green solder mask;

High quality immersion gold pcb board:
1. We have 10 years experience in Printed Circuit Board field to serve your needs
2. Competitive price with high quality service-24 hours online service
3. Prompt delivery reable factory
4. Our Printed Circuit Board get ISO and UL Certificates and meet ROHS standard

NO	ITEM	Technical capabilities
1	Layers	1-20 layers
2	Max. Board size	2000×610mm
3	Min. board Thickness	2-layer  0.25mm
		4-layer  0.6mm
		6-layer  0.8mm
		8-layer  1.5mm
		10-layer  1.6~2.0mm
4	Min. line Width/Space	0.1mm(4mil)
5	Max. Copper thickness	10OZ
6	Min. S/M Pitch	0.15mm(4mil)
7	Min. hole size	0.2mm(8mil)
8	Hole dia. Tolerance (PTH)	±0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	±0.05mm(2mil)
11	Outline tolerance	±0.10mm(4mil)
12	Twist & Bent	0.75%
13	Insulation Resistance	>10 12 Ω Normal
14	Electric strength	>1.3kv/mm
15	S/M abrasion	>6H
16	Thermal stress	288°C 10Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.15mm  (6mil)
19	Surface Finished	HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20	Materials	FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base