• Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
  • Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
  • Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
  • Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
  • Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
  • Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach

Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach

After-sales Service: 1 Year
Koşulunu: Yeni
Hız: Yüksek Hız
Hassasiyet: Hassasiyet
Sertifika: CE
Garanti: 12 ay

Tedarikçi ile İletişime Geçin

Elmas Üye Fiyat 2017

Doğrulanmış işletme lisanslarına sahip tedarikçiler

Temel bilgiler.

Hayır. Modeli.
MD-JC360i MD-JC380i
Otomatik derece
Otomatik
Tip
Yüksek Hızlı Yonga Montaj
Ticari Marka
minder-hightech
Menşei
China
Üretim Kapasitesi
100

Ürün Açıklaması

Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach

Automatic 
die bonder for 
Semiconductor industry IC package 

MD-JC360-D  
MD-JC380-D   MD-JC360  MD-JC380  MD-JC360i    MD-JC380i   MDAX64DI      MD-1412

Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die AttachSemiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die AttachSemiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die AttachSemiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die AttachAutomatic loading and unloading die bonder

Fully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support products;

Modular design, new optimized layout, focus on quality, with the best stable performance;

You can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customers;

Brand-new tying head design, fast die bond cycle up to 180ms;

Patented head binding, accurate positioning and more stable operation;

5mil small chip processing capacity
Design a variety of chip search methods, suitable for the search of various shapes of wafers
Ultra-long PIN (65ms) processing capability to meet different customer needs.

Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die AttachSemiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
Bonding arm
Bonding arm 90 degree
Motor AC servo moto
Wafer work stage
Stroke 6"*6"
resolution 0.2 mil (5μm)
Lead frame wore stage
Lead frame number 1PC
Stroke 10"*6"
Resolution 0.2 mil (5μm)
Die and wafer
Die dimension 5mil*5mil~100mil*100mil
Wafer dimension 6
  :±3°
:±1.5mil
  25g~35g
   
Ejector system  
Sync with the part  
Can adjust the height  
Epoxy picking system
Epoxy picking arm Rotary type
moto AC servo moto
Image recognition system
Method 256 gray
Resolution 1024*768
Optical rate 0.7~4.5x
Accuracy 1.56 μm~8.93 μm
speed
Bonding cycle 180ms
Program storage
Program storage 100
Maximum number of chips per carrier 1024
Number of single carrier boards 1
Die lost checking system
Method Vacuum sensor
Requirement
Voltage AC 220V/50 HZ
Compressed air ≥0.6MPa,70L/min
Vacuum 600mmHg
Maximum power 1800W
Weight 680KG
dimension 1310*1265*1777mm

Equipment real shoot
Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die AttachSemiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach

Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die AttachSemiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die AttachSemiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
We have 16 years of experience in equipment sales ,
and can provide you with a one-stop IC Package Line Equipment solution!

 

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Doğrulanmış işletme lisanslarına sahip tedarikçiler

Kayıtlı Sermaye
1000000 RMB