Product Description
High Quality 99.9% CAS 7440-31-5 Metal Tin Powder
Product Name: Tin Powder
CAS 7440-31-5
Molecular Fomula: Sn
Appearance: Grey Powder
Molecular Weight: 118.70100
Assay: 99%min
Nanometer tin powder prepared by evaporation and condensation method, high sphericity, high purity, small particle size, uniform distribution, large specific surface area, small loose density, good dispersion, high oxidation temperature, good sintering shrinkage, is widely used in metal superhard materials as a fine grain, dispersion strengthening effect, improve the wear resistance and toughness of materials.
| Model |
APS(nm) |
Purity(%) |
SSA(m2/g) |
Volumn Density (g/cm3) |
Density(g/cm3) |
Crystal Form |
Color |
| ZY-Sn001 |
50 |
>99.9 |
27.5 |
0.4 |
5.7 |
spherical |
grey |
| ZY-Sn002 |
500 |
>99.9 |
15 |
1.2 |
5.7 |
spherical |
grey |
| ZY-Sn003 |
1000 |
>99.9 |
8 |
1.5 |
5.7 |
subspherical |
grey |
Application
1. Micro and nano tin powder as a metal nano-lubricating additive: Add 0.1~0.5% nanometer tin powder to lubricating oil and grease to form self-lubricating and self-healing film on the surface of friction pair during friction process, which significantly reduces the anti-wear and anti-friction performance of friction pair;
2. Micro-nano tin powder as an active sintering additive: micro-nano tin powder greatly reduces the sintering temperature of non-metallurgical powder products and high temperature ceramic products in non-metallurgical powder;
3. Micro and nano tin solder: instead of micron tin powder to prepare high-performance welding and packaging alloy materials, used to improve welding performance and reduce welding temperature;
4. Metal and non-metal surface conductive coating treatment: in the absence of oxygen, the temperature below the melting point of the powder coating, this technology can be used for the production of microelectronic devices.
Packaging & Shipping
Standard export neutral packing in 180KG/ Iron Drums or ISO Tank;
20'FCL =14.4MT IN IRON DRUM
Or 21MT IN ISO TANK
Company Profile
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