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Hayır. Modeli.
EMCO#265HF-307P
Performance
High Temperature
Application
SMT PCB LED Lf318
Teknik Özelikler
Sn96.5/Ag3.0/Cu0.5
Menşei
China/Malaysia/India
Ürün Açıklaması
product descriptionElectroloy's - Sn96.5/Ag3.0/Cu0.5 EMCO # 265HF-307P disposable solder paste is a rosin-based solder paste, which has a wide printing operation range and a particularly long downtime and printable period. Its soft, non-adhesive residue improves the reliability of online testing and reduces the frequency of cleaning probes.
feature:1.Probe-testable residue
2.According to IPC J-STD-004 standard ROL0
3.Provides enhanced activity for the robustness of PCB boards and components
4.Outstanding slump resistance
5.Outstanding adhesion performance and printable time
6.Extended "printing period" pauses
7.Bright, colorless residue
8.Halogen-free
Chemical composition of the alloyThe composition of EMCO#265HF-307Plead-free tin wire is strictly controlled in the following LF-307 specifications:
Appearancelead-free solder paste appears as a gray uniform paste.
Tin powder particlesThe size of the solder particles is based on the international standard IPC J-STD-005. Nominal size 4: 38-20 microns
EMCO#503PT-307P Lead-Free Solder Paste Reflow Temperature Curve
Warm upHeat from room temperature to 140-150 ° C at a rate of 1-2 ° C per second. Faster speeds can cause component rupture due to evaporation of adsorbed moisture.
Soaking zoneBetween 150 and 200 degrees Celsius. The soaking zone is used to level the temperature difference on the PCB. It is often used in PCBs with large differences in infrared furnaces and components and copper distribution.
Speed up to refluxMaximum2° C due to different thermal expansion rates inside the element.
ReflowPeak temperature is related to component specifications. In 5-8 seconds, the peak temperature is between 240-245 degrees Celsius, and 40-80 seconds is higher than 220 degrees Celsius.
cool downMaximum 3 ° C due to different thermal expansion rates inside the element.
CleanMisprints can be wiped with commercially available solvent cleaners
After cleaning,EMCO#265HF-307P residue can be left on the circuit board for reflow. If cleaning is required, a commercially available solvent cleaner can be used.
Stencil cleaning It is recommended to wipe with a commercially available screen cleaner wax paper.
packageEach can of solder paste weighs about 0.5 kg and should be tightly sealed. The label should be accompanied by relevant information such as product number, alloy composition, particle size, net weight, and product batch number. Solder tin cans should be placed in foam boxes and packed in cardboard boxes, each box weighing approximately 10 kg. Cartridge or injectable solder pastes can be requested.
Storage and shelf lifePlease store below 3-10 degrees Celsius. The validity period of the solder paste is within six months from the production date. Before using the solder paste, it needs to warm up for about 4 hours before use. Before putting the solder paste on the template, use a spoon to stir the solder paste for 1-2 minutes or the solder paste mixer for 30-60 seconds.
ShipA certificate of analysis is attached to the shipment.
Material Safety Data SheetProduct MSDS / SDS can be obtained from sales department.
Lead-free low-temperature alloys:Alloy number
| Alloy composition | Fuse | Feature | Application |
LF-302 | Sn42 / Bi58 | 138°C | Reasonable shear strength and fatigue resistance. | Can be used for temperature-sensitive parts and LED welding operations.Can be used for multi-step welding and fuse-like fuses operations can also be used for nozzle and exhaust valve operations. |
|
LF-329 | Sn42 / Bi57/Ag1 | 139°C | The addition of silver enhances its mechanical properties, with excellent resistance to thermal fatigue. |
|
LF-323 | Sn64 / Bi35/Ag1 | 170-190°C | The addition of silver enhances its mechanical properties, with excellentresistance to thermal fatigue. |
|
Lead-free medium temperature alloy:Alloy number | Alloy composition | Fuse | Feature | Application |
LF-307 | Sn96.5 / Ag3.0 / Cu0.5 | 217-219°C | Excellent mechanical properties and thermalfatigue performance. | Standard SAC alloy for most SMT applications. |
|
LF-315 | Sn99 / Ag0.3 / Cu0.7 | 216-228°C | Excellent mechanical properties and thermal fatigue performance. | Low cost SAC alloy for most SMT applications. |
|
SN100C | Sn99.3/Cu0.6/Ni+Ge | 227°C | Excellent mechanical properties, bright and smooth solder joints.Excellent through-holesoldering performance. | SnCu alloy instead of SAC alloy for most SMT applications. |
Paste fluxAlloy number | Feature | Flux classification |
EM#502 (HF) | Halogen-free flux, with high shear strength and excellent printing ability.Can also be used for high-speed printing operations.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue. | ROL0 |
EM#503PT (HF) | Halogen-free flux, with high shear strength and excellent printing ability.Has excellent anti-collapse performance and excellent adhesion performance.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue. | ROL0 |
EM#615 | Specially configured flux with excellent printability for ultra-fine pitch welding operation.Its flux can withstand high preheat temperatures and a wide range of operational reflow jobs.It shows excellent wetting on most circuit boards. | ROL1 |
EM#233 | Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.Has excellent anti-collapse performance and excellent adhesion performance.It shows excellent wetting on most circuit boards and leaves only clean residue. | ROL1 |
EM#255 | Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.It shows excellent wetting on most circuit boards.Has excellent anti-collapse performance and excellent adhesion performance.The residue is soft, non-sticky; can be operated on probe test.Residues are clean, printing takes longer and productivity increases. | ROL1 |
EM#265 (HF) | Halogen-free formulations, temperature range can be widely used, printing operation for a long time.Soft, non-stick residue enhances reliability during in-circuit testing and reduces test probe cleaning frequency.Has excellent anti-collapse performance and excellent adhesion performance. | ROL0 |
Adres:
Long Hua town, Long Teng industrial zone of Bo Luo county, Hui Zhou city, Guangdong, China 516122
İşletme Türü:
Ticari Şirket
İşletme Aralığı:
Üretim ve İşleme Makineleri
Şirket Tanıtımı:
Electroloy Group
Electroloy Group, ilk üretim tesisi Electroloy Metal Pte Ltd′nin başlamasıyla 11 Mayıs 1977′te Singapur′da kuruldu. Elektroloy, lehimleme endüstrisindeki lider üreticilerden biri olarak tanınıp kabul edildiği için hızla büyüdü; Genişletme planları kapsamında Malezya, Suzhou Çin, Huizhou Çin ve Noida Hindistan′da ilave üretim tesisleri kuruldu.
Kapsamlı bir lehimleme çözümü görevi sunmak için, Elektroloy ürün geliştirme ve zorlu üretim operasyonlarına başladı ve müşterilerimizin değişen ihtiyaçlarını ve yüksek düzey ihtiyaçlarını karşılamak için yüksek kaliteli lehim ürünleri sağlandı. Elektroloy, coğrafi gelenekler ve sahip olduğumuz çeşitlendirilmiş ofis personeli ile birlikte müşterilerimize
2006 yılında Yüksek kaliteli, yenilikçi lehimleme çözümleri sunmaya devam edeceğinden emin bir şekilde, yüksek düzeyde kapsamlı bir laboratuvar oluşturmak için Bilim, Teknoloji ve Araştırma Dairesi ile birlikte çalıştık. AR-Ge laboratuvarlarımız yalnızca kimyasal ve metal alaşımı araştırmalarına değil, lehimleme ayırma, X-ışını görüntüleme, çekme testi ve yorulma testi gibi entegre test hizmetlerine de odaklanır.
Elektroloy, "Toplam Lehimleme Çözümleri" şirketi olarak kendisini suçlar. Yalnızca ürün sağlamakla kalmıyor, aynı zamanda onlarla birlikte büyüdükçe müşterilerimizle ortaklık kurmayı amaçlıyoruz. Elektronik Endüstrisi için tercih edilen lehim tedarikçisi olmayı hedefliyoruz