• Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor
  • Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor
  • Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor
  • Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor
  • Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor
  • Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor

Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor

Application: Refractory, Structure Ceramic, Industrial Ceramic, Wear Resistance
Type: Ceramic Plates
ürün adı: alüminyum seramik alt tabaka
form verme yöntemleri: bant dökümü, iso basılı, kuru baskılı
i̇steğe bağlı renk: beyaz, fildişi, pembe
malzemenin saflığı: %96, %99, %99.5, %99.8

Tedarikçi ile İletişime Geçin

Ticari Şirket

360° Sanal Tur

Elmas Üye Fiyat 2020

Doğrulanmış işletme lisanslarına sahip tedarikçiler

Sınıflandırma: 5.0/5
Guangdong, Çin
İthalatçılar ve İhracatçılar
Tedarikçinin ithalat ve ihracat hakları vardır
Yüksek Tekrarlı Alıcıların Seçimi
Alıcıların %50'sinden fazlası sürekli olarak tedarikçiyi seçiyor
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Doğrulanmış tüm güç etiketlerini (17) görmek için
  • Genel bakış
  • The Prime Characteristics
  • The specification
  • Product Description
  • Typical Applications
  • We also produce
  • Our Partners
  • FAQ
Genel bakış

Temel bilgiler.

Hayır. Modeli.
Customized
yoğunluk
3,65 g/cm3′ün üzerinde
"mod
sipariş başına 10 adet
kalınlık
0,11 mm ile 30 mm arasında mevcuttur
normial tolerans
kalınlık 0,05 mm olmalıdır
hassasiyet toleransı
kalınlık 0,01 mm olmalıdır
düzlük
i̇nce öğütme ile 0,001 mm olması en iyisidir
özellikler
yüksek dielektrik, yüksek yalıtım
malzeme
alüminyum seramik
Taşıma Paketi
Individual Packaging
Teknik Özelikler
600mm x 500mm
Ticari Marka
JingHui
Menşei
China
HS Kodu
8547100000
Üretim Kapasitesi
5000000/Month

Ürün Açıklaması

Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor
 

The Prime Characteristics

Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor
1. High thermal conductivity, up to 31 W/m.k at 25ºC      
        
2. Quality surface with ideal flatness, warpage and roughness

3. High dielectric strength, low dielectric constant, and dielectric loss.

4. High hardness and exceptional flexural & fracture strength

5. Corrosion resistance and fit for various of harsh enviroments

6. Anti-oxidization and not rust for ever in very humid conditions
                      
7. Easy to achieve different pattern by laser cutting with precision tolerance.

The specification

1. Material : alumina,aluminum nitride, silicon nitride and zirconia optional
 

2. Dimensional capability: Side length max. 400mm x 600mm, Thickness can be range from 0.10mm to 30mm

3. Surface treatment:  natural surface, lapping, diamond-like polishing, metallizing

4. Hole size and tolerance after laser cutting
Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.20

5. The scribing line specification
Substrate Thickness (mm) The Percentage of
Laser Scribe Line Depth
to Thickness (%)
0.2-0.3 40%±5%
0.3<T≤0.5 50%±3%
0.5<T≤1.0 43%±3%
1.2 55%±3%
1.5 55%±3%
2.0 55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-1.0mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Product Description

Laser Scribing ceramic substrates has been increasingly popular since its introduction to the industry nearly 50 years ago. The process involves pulsing a CO2 laser through an optical configuration, through a focusing lens, focusing the beam through an air assisted nozzle assembly, and finally onto the substrate's work surface. Most Laser scribing systems utilize a CNC or PC based motion control system, moving the substrate below the fixed beam assembly at speeds as fast as 10 in./sec, or faster.


Each pulse of the Laser provides an efficient and effective evacuation of molten and ablated ceramic substrate particulates. Well executed scribes allow for subsequent controlled Breaks, or "Snapping", of the substrate to its final size.
 

Typical Applications

Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor

We also produce

Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor
Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor
Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor

Remark:
We not only produce alumina ceramic substrates, but also making both silicon ntiride(Si3N4) ceramic substrate and aluminum nitride (AlN) ceramic substrates
.
 

Our Partners

Laser Scribing Al2O3 Alumina Ceramic Substrate for Chip Resistor

FAQ

Q01: What sizes are available for the Alumina substrates?
A: The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.

 

Q02.What are the main advantages of a Ceramic PCB?

A: Maximum operating temperatures of the substrates of over 800°C, high Thermal Conductivity of up to 180W/mK, very low CTE (Coefficient of Thermal Expansion), 0% water absorption for Hermetic packages, low signal loss and fine microcircuit applications with the DPC production method.

Q03: What is the via diameter available for Alumina substrates?
A: Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.

Q04:How are the ceramic substrates machined?
A: We use 100% laser processes. This is the best way to ensure precise and clean milling and drilling of the ceramic.

Q05: What other products do you manufacture?
A: Yes, we also produce metalized ceramics, ceramic seals and high precision pump plunger and pistons besides alumina ceramic substrates.

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