| Kullanım: | to Realize Electrical Connections |
|---|---|
| bitmiş ürün: | seramik devre kartı |
| alt tabaka malzemesi: | %96, %99.6 alumina |
| yüzey metal işleme işlemi: | doğrudan kaplanmış bakır teknolojisi |
| özellik: | mükemmel elektrik ve termal özellikler |
| Taşıma Paketi: | Vacuum Packaging |
Doğrulanmış işletme lisanslarına sahip tedarikçiler
Denetlenen Tedarikçi Introduction of Direct Plated Copper (DPC) Ceramic Substrate
Direct Plated Copper (DPC) technology is a ceramic circuit processing technology developed on the basis of ceramic thin film processing. Different
from the traditional thick film and thin film processing technology, its processing strengthens the requirements of electrochemical processing. After
the metallization of the ceramic surface is achieved by physical methods, the conductive copper and functional film layers are processed
electrochemically.
Advantages of Direct Plated Copper (DPC) Technology
Compared with other ceramic surface metallization methods, DPC process operates at a lower temperature, generally below 300°C, which reduces
the cost of the manufacturing process and effectively avoids the adverse effects of high temperature on materials.
DPC substrate uses yellow light lithography technology to make graphic circuits, with high pattern precision and vertical interconnection, which is
very suitable for electronic device packaging that requires high circuit precision.
The previous production adopts semiconductor micromachining technology, while the latter production adopts printed circuit board (PCB) production
technology, which has the characteristics of high graphic precision and vertical interconnection, and is mainly used in high-power LED packaging.
If the thermoelectric separation problem is to be solved from the light source, the ceramic substrate needs to meet the following conditions:
1. It must have high thermal conductivity, which is several orders of magnitude higher than that of resin.
2. High dielectric strength.
3. Only with high circuit resolution can the chip be vertically co-connected or flipped.
4. High surface flatness, there will be no voids when welding.
5. Ceramics and metals should have high adhesion.
6. Vertically interconnect via holes so that chip packaging can be realized and the circuit can be led from the back to the front.
Only DPC ceramic substrates meet the above conditions.
In order to ensure the best performance of our ceramic circuit boards, all products have to pass strict inspection before they go out.
Under the trend of intelligence, the application of DPC technology will be more common to meet the needs of miniaturization and high precision.
Jinghui's mature DPC technology can customize the thickness of metal circuits for you to meet your diverse needs.
Doğrulanmış işletme lisanslarına sahip tedarikçiler
Denetlenen Tedarikçi 
